Описание, детайли - CorsaФБr 2GB (2x1GB) DDR3 1600MHz TW3X2G1600C9DHX
| Скорост | 1600 MHz |
| Предназначение | PC памет |
| Размер на паметта | 2 GB |
| Окомплектоване | 2x1GB |
| Тип памет | DDR3 |
Видя грешка в описанието или таблицата? Сигнализирай ни!
The TW3X2G1600C9DHX G is a 2048MByte matched pair of DDR3 SDRAM DIMMs built using
Corsairs latest high performance heat sink with Dual-Path Heat Xchange (DHX) technology. This
part delivers outstanding performance in the latest generation of dual-channel DDR3-based
motherboards. It has been tested extensively in popular DDR3 motherboards to ensure compatibility
and performance at its rated speed. This memory has been verified to operate at 1600MHz at the
low latencies of 9-9-9-24. Dual-Path Heat Xchange Diagram
Optimized fins to maximize ambient airflow through the module array
Extruded aluminum heat sinks to maximize convective heat dissipation
Dedicated PCB heat sink Each module pair is tested together at
1600MHz
Tested and packaged in pairs
Packaged together immediately following
system test
Tested together at 1600MHz, Vdimm =
1.80V, at latency settings of 9-9-9-24
SPD programmed at:
JEDEC standard 7-7-7-20 values at
1066MHz2048 Megabytes of DDR3 memory
Two matched CM3X1G1600C9DHX G
modules
Using DHX technology providing
maximum cooling
100% tested at 1600MHz in high performance
DDR3 motherboards
Lifetime warranty Продукт известен още и като 2 GB 2 x 1 GB DDR 3 1600 MHz TW 3 X 2 G 1600 C 9 DHX, 2GB2x1GBDDR31600MHzTW3X2G1600C9DHX, 2 GB (2 x1GB) DDR3 1600MHz TW3X2 G1600C9DHX, 2GB (2x1GB) DDR3 1600MHz TW3X2G1600C9 DHX
Corsairs latest high performance heat sink with Dual-Path Heat Xchange (DHX) technology. This
part delivers outstanding performance in the latest generation of dual-channel DDR3-based
motherboards. It has been tested extensively in popular DDR3 motherboards to ensure compatibility
and performance at its rated speed. This memory has been verified to operate at 1600MHz at the
low latencies of 9-9-9-24. Dual-Path Heat Xchange Diagram
Optimized fins to maximize ambient airflow through the module array
Extruded aluminum heat sinks to maximize convective heat dissipation
Dedicated PCB heat sink Each module pair is tested together at
1600MHz
Tested and packaged in pairs
Packaged together immediately following
system test
Tested together at 1600MHz, Vdimm =
1.80V, at latency settings of 9-9-9-24
SPD programmed at:
JEDEC standard 7-7-7-20 values at
1066MHz2048 Megabytes of DDR3 memory
Two matched CM3X1G1600C9DHX G
modules
Using DHX technology providing
maximum cooling
100% tested at 1600MHz in high performance
DDR3 motherboards
Lifetime warranty Продукт известен още и като 2 GB 2 x 1 GB DDR 3 1600 MHz TW 3 X 2 G 1600 C 9 DHX, 2GB2x1GBDDR31600MHzTW3X2G1600C9DHX, 2 GB (2 x1GB) DDR3 1600MHz TW3X2 G1600C9DHX, 2GB (2x1GB) DDR3 1600MHz TW3X2G1600C9 DHX