Описание на продукта
Параметри на продукта
Производител
Kingston
Тип
Памет за PC
Размер на паметта
8 GB
Окомплектоване
1x8GB
Тип памет
DDR4
Multi-Channel комплект
Single-channel
CAS латентност
CL 16
Охладителни ребра
Да
Напрежение
1.2 V
Параметри на продукта
Производител
Kingston
Тип
Памет за PC
Размер на паметта
8 GB
Окомплектоване
1x8GB
Тип памет
DDR4
Multi-Channel комплект
Single-channel
CAS латентност
CL 16
Охладителни ребра
Да
Напрежение
1.2 V
Описание на продукта
Kingston HyperX Fury Red HX426C16FR2/8
HyperX HX426C16FR2/8 is a 1G x 64-bit (8GB) DDR4-2666 CL16 SDRAM (Synchronous DRAM) 1Rx8, memory module, based on eight 1G x 8-bit FBGA components per module. Each module supports Intel Extreme Memory Profiles (Intel XMP) 2.0.
Each module has been tested to run at DDR4-2666 at a low latency timing of 16-18-18 at 1.2V. Additional timing parameters are shown in the Plug-N-Play (PnP) Timing Parameters section below. The JEDEC standard electrical and mechanical specifications are as follows:
CL(IDD) : 16 cycles
Row Cycle Time (tRCmin) : 45.75ns(min. )
Refresh to Active/Refresh Command Time (tRFCmin) : 350ns(min. )
Row Active Time (tRASmin) : 29.25ns(min. )
Maximum Operating Power : TBD W*
UL Rating : 94 V - 0
Operating Temperature : 0 C to +85 C
Storage Temperature : -55 C to +100 C
Power Supply: VDD = 1.2V Typical
VDDQ = 1.2V Typical
VPP - 2.5V Typical
VDDSPD = 2.2V to 3.6V
Nominal and dynamic on-die termination (ODT) for
data, strobe, and mask signals
Low-power auto self refresh (LPASR)
Data bus inversion (DBI) for data bus
On-die VREFDQ generation and calibration
Single-rank
On-board I2 serial presence-detect (SPD) EEPROM
16 internal banks; 4 groups of 4 banks each
Fixed burst chop (BC) of 4 and burst length (BL) of 8
via the mode register set (MRS)
Selectable BC4 or BL8 on-the-fly (OTF)
Fly-by topology
Terminated control command and address bus
Height 1.340 (34.04mm), w/o heatsink
HyperX HX426C16FR2/8 is a 1G x 64-bit (8GB) DDR4-2666 CL16 SDRAM (Synchronous DRAM) 1Rx8, memory module, based on eight 1G x 8-bit FBGA components per module. Each module supports Intel Extreme Memory Profiles (Intel XMP) 2.0.
Each module has been tested to run at DDR4-2666 at a low latency timing of 16-18-18 at 1.2V. Additional timing parameters are shown in the Plug-N-Play (PnP) Timing Parameters section below. The JEDEC standard electrical and mechanical specifications are as follows:
CL(IDD) : 16 cycles
Row Cycle Time (tRCmin) : 45.75ns(min. )
Refresh to Active/Refresh Command Time (tRFCmin) : 350ns(min. )
Row Active Time (tRASmin) : 29.25ns(min. )
Maximum Operating Power : TBD W*
UL Rating : 94 V - 0
Operating Temperature : 0 C to +85 C
Storage Temperature : -55 C to +100 C
Power Supply: VDD = 1.2V Typical
VDDQ = 1.2V Typical
VPP - 2.5V Typical
VDDSPD = 2.2V to 3.6V
Nominal and dynamic on-die termination (ODT) for
data, strobe, and mask signals
Low-power auto self refresh (LPASR)
Data bus inversion (DBI) for data bus
On-die VREFDQ generation and calibration
Single-rank
On-board I2 serial presence-detect (SPD) EEPROM
16 internal banks; 4 groups of 4 banks each
Fixed burst chop (BC) of 4 and burst length (BL) of 8
via the mode register set (MRS)
Selectable BC4 or BL8 on-the-fly (OTF)
Fly-by topology
Terminated control command and address bus
Height 1.340 (34.04mm), w/o heatsink
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