MSI GeForce RTX 4070 Ti GAMING X TRIO 12G GDDR6
Най-евтини оферти (1)
Описание на продукта
Параметри на продукта
Параметри на продукта
Описание на продукта
Hardening every detail
High-Efficiency Carbonyl Inductors (HCI)
Manufacturing and material improvements to our choke parts have culminated as High-Efficiency Carbonyl Inductors (HCI. ) One-piece molding allows this design to operate with less choke noise and better electrical filtering.
DrMos
DrMOS power stage solutions provide great efficiency with low power loss and enhanced voltage controls.
Change Focus When Needed
Dual BIOS gives you the choice to prioritize full performance in GAMING mode or low noise in SILENT mode.
Effective Thermal Padding
An abundance of clay-based thermal pads provide additional heat dissipation for board components.
Hardened Defenses
Additional fuses built into the custom PCB provide additional safeguards against electrical damage.
SPECIFICATIONS
Model Name GeForce RTX 4070 Ti GAMING X TRIO 12G
Graphics Processing Unit NVIDIA ®GeForce RTX 4070 Ti
Interface PCI Express ®Gen 4
Core Clocks
Extreme Performance: 2760 MHz (MSI
Center)
Boost: 2745 MHz (GAMING & SILENT Mode)
CUDA ®CORES 7680 Units
Memory Speed 21 Gbps
Memory 12GB GDDR6X
Memory Bus 192-bit
Output
DisplayPort x 3 (v1.4a)
HDMI x 1 (Supports 4K@120Hz HDR, 8K@60Hz HDR, and Variable Refresh Rate asspecified in HDMI 2.1a)
HDCP Support Yes
Power consumption 285 W
Power connectors 16-pin x 1
Recommended PSU 700 W
Card Dimension (mm) 337 x 140 x 62 mm
Weight (Card / Package) 1594 g / 2468 g
DirectX Version Support 12 Ultimate
OpenGL Version Support 4.6
Maximum Displays 4
G-SYNC ®technology Yes
Digital Maximum Resolution 7680 x 4320
FEATURES
TRI FROZR 3
Stay cool and quiet. MSI’s TRI FROZR 3 thermal design enhances
heat dissipation all around the graphics card.
TORX FAN 5.0
Fan blades linked by ring arcs and a fan cowl work together to
stabilize and maintain high-pressure airflow.
Copper Baseplate
The CNC machined nickel-plated copper base captures heat from
the GPU and the memory then rapidly transfers it to Core Pipes.
Core Pipe
Precision-machined heat pipes ensure max contact and spread
heat along the full length of the heatsink.
Airflow Control
Sections of different heatsink fins disrupt unwanted airflow
harmonics and reduce noise.
Anti Bending
A die-cast anti-bending plate reinforces the card while thermal
pads allow cooling to reach critical component underneath.
Metal Backplate
Thermal pads under the sturdy metal backplate provide additional
cooling while the flow-through ventilation reduces trapped heat.
Dual BIOS
Dual BIOS lets you set the priority to full performance in GAMING
mode or low noise in SILENT mode.
Липсва или е неправилен важен параметър? Предоставената информация е само за ориентиране, затова ви съветваме да проверите дали предлаганият продукт има ключовите параметри от които се нуждаете, преди да купите от магазина по ваш избор. Въпреки че се стремим към максимална точност на информацията, за съжаление не можем винаги да гарантираме 100% съответствие. Цените на продуктите са с включен ДДС.
Продуктът все още няма отзиви.